Products include high power RF components, 10G/40G optical modules and transponders , wafer-scale glass frit bonding technology and high-reliability integrated electronic assemblies.
Processes developed include high resolution screen printing, wafer printing/bonding, flip-chip die attach, automated epoxy dispensing, plasma cleaning and laser sealing. McKleroy Associates will optimize most semiconductor processes for production.
Packaging Designs include electronic integrated module designs and advanced semiconductor packaging solutions.
Program Management: McKleroy Associates has a proven track record in technical program and supplier management. It has the expertise to address and resolve the critical issues to meet time-to-market production goals.